Detailed Product Description

Electroplating is a useful method to produce alloy or heterogeneity films used for electronic materials. Of them, ternary plating used for magnetic or magneto resistor materials show superior properties compared to a single or binary plating. For example, Cu/Ni/Co alloy shows excellent peel strength, appropriate magnetism and excellent etching property. To maximize the surface area of a ternary plating film, JeonYoung deposits   size nodular on a substrate surface using pulse technology and then add an encapsulating layer on the nodular surface which stabilizes its structure. By repeating nodular encapsulating processes, JeonYoung produces ternary plating films from nanometer to micrometer thicknesses. As prepared ternary foils are broadly used as FPC, PTC and FCCL materials due to the easy bonding behavior to a polymer which shows very weak bonding power.